Design and Manufacturing Services

ECS opens the door to design and manufacturing so your products are European quality at Asian prices.

From complete Design and Manufacturing Services to re-engineering of existing products, ECS can make you more productive and more profitable. We can help you "Asianize" your BOMs to cut costs or even change your BOMs to comply with RoHS.
Since more then a decade our highly skilled engineers have proven their capability in many international projects.

Certifications | Engeneering Capabilities | Test Systems | Production Capabilities | Special Equipment | RoHS | System Capabilities


Kontron Malaysia Facilities (KMS) ° ~ 500 employees ° 120,000 sq feet ° 6 SMT production lines ° 16 system assembly lines ° 1,500.000 Embedded boards per Year ° 500,000 Systems per Year
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Design and Development Services More Details

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KMS Certifications ° ISO 9001:2000 (Design & Manufacturing) ° ISO 18001:1997 (Occupational Safety & Health) ° ISO 14001:1997 (Environmental) ° ISO 13485:2004 (Medical) ° FDA Registred May 2006 ° OHSAS 18001 1999 ° TS16949 - Target for full compliance in Q3 / Q4 2008 ° Accredidation - TUV, UL, ETL, Nemko


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KMS Engineering Capabilities ° World class Tier-1 services offering ° Low volume, high mix capability ° Board and systems integration / Box-build capability ° NPI center known for excellent support on product design / prototyping activities ° Test development services ° Extensive RF design and support for wireless technology ° Global presence in Supply Chain Management; Full Turnkey ° Logistics and fulfillment services ° Re-Engineering of existing products ° Evaluate second sources ° Development of Test Fixtures and Test software ° Changing BOM’s to RoHS ° “Asianize” BOM’s to cut costs ° Used to work with international partners ° Very good communication skills

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Examples of Test System Design
Rear Projector TV Tester	Amplifier Tester	Functional Test Station

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Functional Test Development
Customized Software Download Station	Hi Pot Tester	Customized Functional Tester

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KMS Production Capabilities ° RoHS & Lead Free Capability ° Intrusive reflow (paste in pin technology) ° OLGA (flip chip) angle placement ° SMT socket placement capability ° Hybrid BGA at SMT reflow ° Micro BGA (<15mm size) ° 0201 & 0402 chipset placement capability ° Double sided 10 layers PCBA process ° 16 mils IC’s pitch printing & placement accuracy with Cpk >1.33 ° Larger PCB size ° Metal base PCB (heat sink) on amplifier product ° ThermalClad® PCBA with mosfet on SMT placement ° Mosfet with optimum void (<5%)




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Special Equipment
Epoxy Dispenser	L&R Ultrasonic Cleaning Equipment	Ultrasonic Moulding Equipment


SMT Complex BGA Rework (Sierra Research Technology)	Electrovert Aqueous Cleaning System	X-TEK X-Ray Compact

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RoHS Compliance Already Implemented







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Special Capabilities in System Assembly
° Extended Burn-In in Temp Cycle chamber ° On-going Reliability Test ° Critical Temperature Calibration ° Ultrasonic Welding ° Managing scratches for metal & plastic chassis ° Managing colour variation in metal & plastic

System Production – High Runners

Board Assembly (1)	Board Assembly (2)	Main Board Assembly (1)

Main Board Assembly (2)	Casing Assembly (1)	Casing Assembly (2)
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